Method of processing a semiconductor wafer that involves cutting to form grooves along the dicing lines and grinding reverse side of the wafer

1. A method of processing a wafer having a plurality of projected dicing lines on a face side thereof and a plurality of devices formed in respective areas of the face side that are demarcated by the projected dicing lines, comprising:

a cutting step of cutting the face side of the wafer with a cutting blade to form grooves therein along the projected dicing lines to a depth in excess of a finished thickness of the wafer;

a first inspecting step of capturing an image of the grooves formed in the cutting step from the face side of the wafer using an image capturing unit and inspecting a state of a chip in the captured image of the grooves using a control unit;

after the first inspecting step, a protecting member sticking step of sticking a protective member to the face side of the wafer;

a grinding step of holding the protective member side of the wafer on a chuck table and grinding a reverse side of the wafer to thin the wafer to a finished thickness, thereby dividing the wafer into device chips; and

after the grinding step, a second inspecting step of capturing an image of the grooves exposed on the reverse side of the wafer from the reverse side of the wafer using a camera and inspecting a state of a chip in the captured image of the grooves using the control unit.

2. The method of processing a wafer according to claim 1 , wherein each of the first inspecting step and the second inspecting step includes the steps of acquiring positional information of the grooves in the wafer whose image has been captured using the control unit and acquiring positional information of the inspected chip using the control unit.

3. A grinding apparatus comprising:

a chuck table for holding a wafer having grooves cut therein on a holding surface thereof;

a grinding unit grinding the wafer held on the chuck table with grinding stones mounted on a spindle having a rotational axis perpendicular to the holding surface of the chuck table; and

an inspecting unit having a camera for capturing an image of the grooves which are exposed on a reverse side of the wafer when the wafer held on the chuck table is ground by the grinding unit, wherein the inspecting unit inspects a state of a chip in the grooves from the image captured by the camera and acquires the result of inspection of the grooves together with positional information of the grooves in the wafer.

4. The method of claim 1 wherein the wafer has a plurality of devices formed on a face side of the wafer; and

wherein when the grooves are cut along the projected dicing lines, at least one chip is formed in an edge portion of at least one of the grooves.

5. The method of claim 4 wherein at least one of the first inspecting step or second inspecting step comprises the control unit receiving the image of the grooves and determining if the chip extends beyond a predetermined distance from a center of an associated dicing line.

6. The method of claim 5 further comprising the control unit categorizing an individual device chip as a NG (No Good) device chip if the device chip has an edge having a chip therein that has been determined to extend beyond the predetermined distance from a center of an associated dicing line.

7. The method of claim 6 wherein both the first inspecting step and second inspecting step comprise the control unit receiving the image of the grooves and determining if the chip extends beyond a predetermined distance from a center of an associated dicing line.

8. The grinding apparatus of claim 3 wherein the wafer has a plurality of devices formed on a face side of the wafer and having grooves cut therein along projected dicing lines on a face side of the wafer, wherein the grooves are cut to a depth in excess of a finished thickness of the wafer; and wherein when the grinding unit grinds the wafer to a finished thickness, the wafer is divided into individual device chips, and wherein when the grooves are cut along the projected dicing lines, at least one chip is formed in an edge portion of at least one of the grooves.

9. The grinding apparatus of claim 8 , wherein inspecting unit further comprises a control unit that receives the image of the grooves captured by the camera and determines if the chip extends beyond a predetermined distance from a center of an associated dicing line.

10. The grinding apparatus of claim 9 , wherein inspecting unit categorizes an individual device chip as a NG (No Good) device chip if the device chip has an edge having a chip therein that has been determined to extend beyond the predetermined distance from a center of an associated dicing line.