Patent Assignment
Reel/Frame 049323/0453
Assignment of Assignor's Interest
Recorded: 2019-05-30
Pages: 4
Assignors
CHEAH, BOK ENG
Executed: 2018-08-09
KONG, JACKSON CHUNG PENG
Executed: 2018-08-10
YONG, KHANG CHOONG
Executed: 2018-08-10
LIM, YUN ROU
Executed: 2018-08-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Folded Semiconductor Package Architectures and Methods of Assembling Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.