Patent Assignment
Reel/Frame 049329/0369
Assignment of Assignor's Interest
Recorded: 2019-05-31
Pages: 7
Assignors
MORITA, MASAKI
Executed: 2019-04-26
NAKAMURA, KONATSU
Executed: 2019-04-26
TAKANEZAWA, SHIN
Executed: 2019-04-26
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2 MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Support-Provided Insulating Layer, Laminate, and Wiring Board
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 13, 2022
From: HITACHI CHEMICAL COMPANY, LTD
To: SHOWA DENKO MATERIALS CO., LTD
Reel/Frame 058746/0637 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →