Patent Assignment
Reel/Frame 058746/0637
Change of Name
Recorded: 2022-01-13
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Support-Provided Insulating Layer, Laminate, and Wiring Board
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 31, 2019
From: MORITA, MASAKI; NAKAMURA, KONATSU; TAKANEZAWA, SHIN
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 049329/0369 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →