Patent Assignment
Reel/Frame 049349/0506
Assignment of Assignor's Interest
Recorded: 2019-06-03
Pages: 9
Assignors
KONG, JACKSON CHUNG PENG
Executed: 2019-05-10
CHEAH, BOK ENG
Executed: 2019-05-10
HECK, HOWARD L
Executed: 2019-05-13
LIM, SEOK LING
Executed: 2019-05-11
ONG, JENNY SHIO YIN
Executed: 2019-05-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Stiffener-Integrated Interconnect Bypasses for Chip-Package Apparatus and Methods of Assembling Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.