IP Library › Assignment 049365/0887
Patent Assignment
Reel/Frame 049365/0887

Assignment of Assignor's Interest

Recorded: 2019-06-04 Pages: 4
Assignor
DONG, XIANGDAN
Executed: 2019-04-22
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1188, HEZUO RD., (WEST ZONE), HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property (1)
Array Substrate Including Metal Strip, Manufacturing Method Thereof and Display Device
Application: 16/466,531 →
Publication: US 2021/0358956
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 4, 2019
From: MA, HONGWEI
To: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 049365/0402 →
Assignment of Assignor's Interest Jun 4, 2019
From: ZHANG, KAI
To: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 049365/0734 →
Assignment of Assignor's Interest Jun 4, 2019
From: XIAO, YUNSHENG
To: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 049365/0834 →