IP Library › Assignment 049436/0177
Patent Assignment
Reel/Frame 049436/0177

Assignment of Assignor's Interest

Recorded: 2019-06-11 Pages: 4
Assignors
RIEMER, DOUGLAS P.
Executed: 2019-06-03
LADWIG, PETER F.
Executed: 2019-06-03
Assignee
HUTCHINSON TECHNOLOGY INCORPORATED
40 WEST HIGHLAND PARK DRIVE NE, HUTCHINSON, MINNESOTA, 55350
Covered Property (1)
Plating Method To Reduce Or Eliminate Voids In Solder Applied Without Flux
Application: 16/366,064 →
Publication: US 2019/0316267
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 22, 2026
From: HUTCHINSON TECHNOLOGY INCORPORATED
To: MOUND LASER & PHOTONICS CENTER, INC.
Reel/Frame 076110/0518 →