Patent Assignment
Reel/Frame 076110/0518
Assignment of Assignor's Interest
Recorded: 2026-09-22
Pages: 7
Assignor
HUTCHINSON TECHNOLOGY INCORPORATED
Executed: 2026-05-26
Assignee
MOUND LASER & PHOTONICS CENTER, INC.
26 WHIPPLE STREET, NASHUA, NEW HAMPSHIRE, 03060
Covered Properties
(12)
Component Identification
Electroless Nickel Etch Chemistry, Method Of Etching And Pretreatment
Etch Chemistry For Metallic Materials
Gold Plating On Metal Layer For Backside Connection Access
Integrated Sensors
Miniature Pressure/Force Sensor with Integrated Leads
Miniature Pressure/Force Sensor With Integrated Leads
Miniature Pressure/Force Sensor With Integrated Leads
Photoresist Spectral Sensitivity Matching Radiometer For Trace/Space Width Variation Improvement
Plasma Treatments for Flexures of Hard Disk Drives
Plating Method To Reduce Or Eliminate Voids In Solder Applied Without Flux
Treatment Methods And Solutions For Improving Adhesion Of Gold Electroplating On Metal Surfaces
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2017
From: DAVIS, MICHAEL W.; LADWIG, PETER F.; LANG, MATTHEW S.; MYERS, DEAN E.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 041782/0693 →
Assignment of Assignor's Interest
Jun 11, 2019
From: RIEMER, DOUGLAS P.; LADWIG, PETER F.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 049436/0177 →
Assignment of Assignor's Interest
Aug 23, 2019
From: FISCHER, KURT F.; HAAS, ALEX W.; HORNER, MATTHEW J.; LADWIG, PETER F.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 050147/0508 →
Assignment of Assignor's Interest
Aug 27, 2019
From: LANG, MATTHEW S.; LALONDE, LAWRENCE E.; TOBIAS, KYLE T.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 050187/0631 →
Assignment of Assignor's Interest
Aug 27, 2019
From: POKORNOWSKI, ZACHARY A.; GREELEY, RONALD A.; ZELLER, TERRY W.; RIBAR, JEFFERY G.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 050187/0651 →
Assignment of Assignor's Interest
Jan 16, 2020
From: RIEMER, DOUGLAS P.; LADWIG, PETER F.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 051541/0286 →
Assignment of Assignor's Interest
Sep 28, 2020
From: MYERS, DEAN E.; DAVIS, MICHAEL W.; OLSEN, CLARK T.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 053900/0425 →
Assignment of Assignor's Interest
Sep 28, 2020
From: GAGNON, BEAUREGARD J.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 053900/0396 →
Assignment of Assignor's Interest
Oct 1, 2020
From: JELKIN, DUANE M.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 053962/0693 →
Assignment of Assignor's Interest
Oct 1, 2020
From: OLSEN, CLARK T.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 053962/0569 →
Assignment of Assignor's Interest
Sep 20, 2021
From: PESAVENTO, PAUL V.; GROVE, COLLIN M.; RIEMER, DOUGLAS P.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 057535/0355 →
Assignment of Assignor's Interest
Oct 28, 2021
From: HORNER, MATTHEW J.; VANGARA, GOWTHAM V.; RIEMER, DOUGLAS P.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 057950/0408 →
Assignment of Assignor's Interest
Jan 28, 2022
From: DAVIS, MICHAEL W.; LADWIG, PETER F.; LANG, MATTHEW S.; MYERS, DEAN E.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 058902/0348 →
Assignment of Assignor's Interest
Feb 28, 2024
From: DAVIS, MICHAEL W.; LADWIG, PETER F.; LANG, MATTHEW S.; MYERS, DEAN E.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 066589/0901 →