Component identification
An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
1. An identification device comprising:
a first metal layer patterned into a planar coil winding configured to have an inductance;
a second metal layer electrically connected to the first metal layer, the second metal layer includes an outer layer and a central overlapping area connected to the outer layer that overlaps with the first metal layer and configured to have a capacitance, wherein an aperture is formed between the central overlapping area and the outer layer; and
a dielectric layer separating the first metal layer and the second metal layer.
2. The identification device of claim 1 , wherein the outer layer of the second metal layer is electrically connected to the first metal layer with one or more vias.
3. The identification device of claim 2 , wherein the capacitance of the second metal layer is adjustable by adjusting the one or more overlapping areas and a presence and a location of the one or more vias that electrically connect the first and second metal layers.
4. The identification device of claim 1 , wherein the one or more overlapping areas of the second metal layer overlap a first portion of the first metal layer.
5. The identification device of claim 1 , wherein the identification device is a v configured to absorb power that is maximized at a resonance frequency (f res ) of the laminate structure when inductively coupled to an AC magnetic field.
6. The identification device of claim 5 , wherein the resonant frequency of the laminate structure is set to a specific target frequency and/or frequency spectrum to uniquely identify an attached component.
7. The identification device of claim 6 , wherein the resonant frequency of the laminate structure is characterized with a frequency sweep of a measured impedance, the measured impedance is either reflected by or transmitted to an inductively coupled detector coil placed near the laminate structure.
8. The identification device of claim 1 , wherein the inductance of the first metal layer is configured by adjusting at least one of a coil diameter, number of coil turns and width of a coil trace.
9. The identification device of claim 8 , wherein a resonance frequency full width half maximum (FWHM), sharpness, and quality factor of the first metal layer is configured by adjusting a height of the coil trace.
10. The identification device of claim 1 , wherein the second metal layer includes more than one segmented areas.
11. The identification device of claim 10 , wherein the more than one segmented areas are meandered.
12. The identification device of claim 1 , wherein the capacitance of the second metal layer is configured by adjusting at least one of a thickness of the dielectric layer, and a composition of the dielectric layer.
13. The identification device of claim 1 , wherein the dielectric layer is made of polyimide and has a thickness between 0.007-0.015 mm thickness.
14. The identification device of claim 1 , wherein the first metal layer is made of copper and has a thickness between 0.005-0.018 mm thickness.
15. The identification device of claim 1 , wherein the second metal layer includes Stainless Steel or Copper Alloy and has a thickness between 0.018-0.055 mm thickness.
16. A component comprising:
an identification device including:
a first metal layer patterned into a planar coil winding configured to have an inductance;
a second metal layer electrically connected to the first metal layer, the second metal layer is patterned to provide an outer layer and a central overlapping area that connects to the outer layer and overlaps with the first metal layer and is configured to have a capacitance, wherein an aperture is formed between the central overlapping area and the outer layer; and
a dielectric layer separating the first metal layer and the second metal layer.
17. The component of claim 16 , wherein the outer layer of the second metal layer is electrically connected to the first metal layer with one or more vias.
18. The component of claim 17 , wherein the capacitance of the second metal layer is configured by adjusting the one or more overlapping areas and a presence and a location of the one or more vias that electrically connect the first and second metal layers.
19. The component of claim 16 , wherein the one or more overlapping areas of the second metal layer overlap a first portion of the first metal layer.
20. The component of claim 16 , wherein the dielectric layer is made of polyimide and has a thickness between 0.007-0.015 mm thickness.
21. The component of claim 16 , wherein the first metal layer is made of copper and has a thickness between 0.005-0.018 mm thickness.