Plasma treatments for flexures of hard disk drives

1. A method of producing a flexible circuit, the method comprising:

directing a gas that is perpendicular to a surface of the flexible circuit, the gas penetrating a first electrode located above the flexible circuit, the flexible circuit being part of a web that includes a plurality of circuits including the flexible circuit, wherein the flexible circuit includes a flexible metal substrate and a dielectric polymer layer disposed on the metal substrate;

depositing a seed layer on the dielectric polymer layer, wherein an opening is formed on the dielectric polymer layer to expose a portion of the flexible metal substrate;

covering a portion of the seed layer with a patterned photoresist layer;

electroplating a conductive metal onto portions of the seed layer not covered by the patterned photo-resist layer to form a plurality of conductive traces, wherein a first conductive trace of the plurality of conductive traces are formed in the opening of the dielectric polymer layer that establishes an electrical connection between the at least one conductive trace and the flexible metal substrate and a second conductive trace of the plurality of conductive traces is at least partially disposed over the dielectric polymer layer;

plating another conductive metal onto the plurality of conductive traces by electroless plating;

stripping away the patterned photoresist layer to expose the portion of the seed layer; etching away the exposed portion of the seed layer to expose a portion of a surface of the dielectric polymer layer;

forming a dielectric polymer coating over each of the plurality of conductive traces and at least part of the dielectric polymer layer such that a part of the dielectric polymer layer is exposed between conductive traces of the plurality of conductive traces;

applying an alternative voltage to the first electrode to generate a voltage differential between the first electrode and a second electrode connected to a ground, wherein the voltage differential creates an atmospheric plasma from the gas, the second electrode located below the flexible circuit; and

treating the surface of the flexible circuit and the exposed portion of the surface of the dielectric polymer layer with the atmospheric plasma, the second electrode including a roller that is in contact with the web and supports and propels the web including at least the flexible circuit through the atmospheric plasma in a direction that is perpendicular to the gas, wherein the atmospheric plasma removes conductive contaminants from the exposed portion of the surface of the dielectric polymer layer between adjacent conductive traces.

2. The method of claim 1 , wherein the flexible circuit includes a flexible metal substrate and the dielectric polymer layer disposed on the metal substrate, the method further comprising:

forming at least one opening in the dielectric polymer layer to expose a portion of a surface of the metal substrate;

treating the exposed portion of the surface of the metal substrate with the atmospheric plasma to remove contaminants from the exposed portion of the metal substrate;

depositing the seed layer on the dielectric polymer layer and the treated surface of the metal substrate; and

forming the plurality of conductive traces on the seed layer, wherein at least one of the conductive traces extends to the treated surface of the metal substrate to form an electrical contact between the conductive trace and the metal substrate.

3. The method of claim 1 , wherein the flexible circuit includes the flexible metal substrate, the dielectric polymer layer disposed on the flexible metal substrate, and the plurality of conductive traces disposed on the dielectric polymer layer, the method further comprising:

treating a surface of the dielectric polymer layer with the atmospheric plasma, wherein the atmospheric plasma functionalizes the surface of the dielectric polymer layer; and

forming the dielectric polymer coating covering the plurality of conductive traces and a portion of the functionalized surface of the dielectric polymer layer adjacent to each of the plurality of conductive traces.

4. The method of claim 1 , wherein the flexible circuit includes the flexible metal substrate, the dielectric polymer layer disposed on the metal substrate, the seed layer, and the plurality of conductive traces disposed on the seed layer, the method further comprising:

forming at least one opening through the flexible metal substrate on a side opposite the dielectric polymer layer;

etching the dielectric polymer layer through the at least one opening to expose a portion of a surface of the seed layer of one of the plurality of conductive traces; and

treating the exposed portion of the surface of the seed layer with the atmospheric plasma, wherein the atmospheric plasma removes contaminants from the exposed portion of the surface of the seed layer to enable formation of an electrical connection to the conductive trace.

5. The method of claim 1 , wherein the gas consists essentially of oxygen.

6. The method of claim 1 , wherein the flexible circuit is produced by web processing and the surface of the flexible circuit is treated with the atmospheric plasma as the flexible circuit moves through the atmospheric plasma.

7. The method of claim 1 , further comprising: directing gas into a second flow of gas, the second flow of gas flowing through a gas port separate from the first flow of gas and located between the first electrode and the flexible circuit.

8. A method of producing a flexible circuit, the method comprising:

directing a gas that is perpendicular to a surface of the flexible circuit, gas penetrating a first electrode configured to be located above the flexible circuit, wherein the flexible circuit includes a flexible metal substrate and a dielectric polymer layer disposed on the metal substrate;

depositing a seed layer on the dielectric polymer layer, wherein an opening is formed on the dielectric polymer layer to expose a portion of the flexible metal substrate;

covering a portion of the seed layer with a patterned photoresist layer;

electroplating a conductive metal onto portions of the seed layer not covered by the patterned photo-resist layer to form a plurality of conductive traces, wherein a first conductive trace of the plurality of conductive traces are formed in the opening of the dielectric polymer layer that establishes an electrical connection between the at least one conductive trace and the flexible metal substrate and a second conductive trace of the plurality of conductive traces is at least partially disposed over the dielectric polymer layer;

plating another conductive metal onto the plurality of conductive traces by electroless plating;

stripping away the patterned photoresist layer to expose the portion of the seed layer; etching away the exposed portion of the seed layer to expose a portion of a surface of the dielectric polymer layer;

forming a dielectric polymer coating over each of the plurality of conductive traces and at least part of the dielectric polymer layer such that a part of the dielectric polymer layer is exposed between conductive traces of the plurality of conductive traces;

applying an alternative voltage to the first electrode to generate a voltage differential between the first electrode and a second electrode connected to a ground, wherein the voltage differential creates an atmospheric plasma from the gas, the second electrode located below a web supporting the flexible circuit;

treating the surface of the flexible circuit the exposed portion of the surface of the dielectric polymer layer with the atmospheric plasma, wherein the atmospheric plasma removes conductive contaminants from the exposed portion of the surface of the dielectric polymer layer between adjacent conductive traces; and

treating the surface of the flexible circuit with a beam of ions having a mean ion energy ranging from 500 electron volts to 1,500 electron volts, the second electrode supporting and propelling the web through the atmospheric plasma in a direction that is perpendicular to gas and the beam of ions.

9. The method of claim 8 , further comprising: directing gas into a second flow of gas, the second flow of gas flowing through a gas port separate from the first flow of gas and located between the first electrode and the flexible circuit.