Patent Assignment
Reel/Frame 049436/0809
Assignment of Assignor's Interest
Recorded: 2019-06-11
Pages: 4
Assignors
HUANG, PO-HSIANG
Executed: 2019-05-22
LIU, CHIN-CHOU
Executed: 2019-05-22
CHIEN, CHIN-HER
Executed: 2019-05-22
CHANG, FONG-YUAN
Executed: 2019-05-22
LEE, HUI YU
Executed: 2019-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Heat Dissipation Structure Including Stacked Chips Surrounded by Thermal Interface Material Rings