Patent Assignment
Reel/Frame 049439/0217
Assignment of Assignor's Interest
Recorded: 2019-06-12
Pages: 22
Assignors
WANG, HUI-LIN
Executed: 2019-06-10
WENG, CHEN-YI
Executed: 2019-06-10
TSENG, YI-WEI
Executed: 2019-06-10
HSIEH, CHIN-YANG
Executed: 2019-06-10
JHANG, JING-YIN
Executed: 2019-06-10
LEE, YI-HUI
Executed: 2019-06-10
LIU, YING-CHENG
Executed: 2019-06-10
SHIH, YI-AN
Executed: 2019-06-10
TSENG, I-MING
Executed: 2019-06-10
WANG, YU-PING
Executed: 2019-06-10
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same