Patent Assignment
Reel/Frame 049447/0021
Assignment of Assignor's Interest
Recorded: 2019-06-12
Pages: 3
Assignor
ELUMALAI, KARTHIK
Executed: 2018-11-09
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatus for Controlling Warpage in Wafer Level Packaging Processes
Application:
62/751,200 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 13, 2019
From: LIANTO, PRAYUDI; RAFI, MOHAMED; SULAIMAN, MUHAMMAD AZIM BIN SYED; SEE, GUAN HUEI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 050370/0929 →
Assignment of Assignor's Interest
Nov 5, 2019
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 050917/0604 →