IP Library › Assignment 050370/0929
Patent Assignment
Reel/Frame 050370/0929

Assignment of Assignor's Interest

Recorded: 2019-09-13 Pages: 6
Assignors
LIANTO, PRAYUDI
Executed: 2018-11-08
RAFI, MOHAMED
Executed: 2018-11-09
SULAIMAN, MUHAMMAD AZIM BIN SYED
Executed: 2019-02-04
SEE, GUAN HUEI
Executed: 2018-11-09
ANG, YU XIN KRISTY
Executed: 2018-11-18
THIRUNAVUKARASU, SRISKANTHARAJAH
Executed: 2018-11-09
SUNDARRAJAN, ARVIND
Executed: 2018-11-09
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Methods and Apparatus for Controlling Warpage in Wafer Level Packaging Processes
Application: 62/751,200 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 12, 2019
From: ELUMALAI, KARTHIK
To: APPLIED MATERIALS, INC.
Reel/Frame 049447/0021 →
Assignment of Assignor's Interest Nov 5, 2019
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 050917/0604 →