IP Library › Assignment 049457/0698
Patent Assignment
Reel/Frame 049457/0698

Assignment of Assignor's Interest

Recorded: 2019-06-13 Pages: 6
Assignors
SHEN, HSIANG-KU
Executed: 2019-05-21
KAO, MING-HONG
Executed: 2019-05-20
CHEN, HUI-CHI
Executed: 2019-05-22
CHEN, DIAN-HAO
Executed: 2019-05-21
CHEN, YEN-MING
Executed: 2019-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Metal-Insulator-Metal Capacitive Structure and Methods of Fabricating Thereof
Application: 16/439,385 →
Publication: US 2020/0105863
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 4TH Assignors Name Previously Recorded at Reel: 049457 Frame: 0698. Assignor(S) Hereby Confirms the Assignment. Apr 21, 2021
From: SHEN, HSIANG-KU; KAO, MING-HONG; CHEN, HUI-CHI; CHEN, DIAN-HAU
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 055985/0533 →