Patent Assignment
Reel/Frame 049468/0628
Release of Security Interest
Recorded: 2019-06-14
Pages: 12
Assignor
MORGAN STANLEY SENIOR FUNDING, INC.
Executed: 2019-02-11
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property
(1)
Packaging Reliability Superchips
Patent:
7,102,377 →
Application:
11/159,913 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 20, 2005
From: BLANCHET, JASON E.; CRAIN, JAMES V., JR.; GRIFFIN, CHARLES W.; STONE, DAVID B.
To: INTERNAIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 016548/0965 →
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →