IP Library Assignment 049526/0969
Patent Assignment
Reel/Frame 049526/0969

Assignment of Assignor's Interest

Recorded: 2019-06-19 Pages: 7
Assignors
WAN, ZHIMIN
Executed: 2019-06-17
CHAN ARGUEDAS, SERGIO ANTONIO
Executed: 2019-06-12
LI, PENG
Executed: 2019-06-16
JHA, CHANDRA MOHAN
Executed: 2019-06-12
ANTONISWAMY, ARAVINDHA R.
Executed: 2019-06-12
XU, CHENG
Executed: 2019-06-12
ZHAO, JUNNAN
Executed: 2019-06-13
WANG, YING
Executed: 2019-06-12
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Vented Lids for Integrated Circuit Packages
Application: 16/446,538 →
Publication: US 2020/0402884
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072850/0834 →