Patent Assignment
Reel/Frame 049533/0623
Assignment of Assignor's Interest
Recorded: 2019-06-20
Pages: 4
Assignors
TSAI, PO-HAO
Executed: 2019-06-13
LIN, MENG-LIANG
Executed: 2019-06-13
CHUANG, PO-YAO
Executed: 2019-06-13
WONG, TECHI
Executed: 2019-06-13
JENG, SHIN-PUU
Executed: 2019-06-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package with Fan-Out Feature