IP Library › Assignment 049573/0173
Patent Assignment
Reel/Frame 049573/0173

Assignment of Assignor's Interest

Recorded: 2019-06-25 Pages: 2
Assignors
FURUKAWA, TOMOYASU
Executed: 2019-04-22
MORITA, TOSHIAKI
Executed: 2019-04-25
KAWASE, DAISUKE
Executed: 2019-04-22
TABATA, TOSHIHITO
Executed: 2019-04-23
Assignee
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI, IBARAKI, JAPAN
Covered Property (1)
Semiconductor Device Having a Stacked Electrode with an Electroless Nickel Plating Layer
Application: 16/450,252 →
Publication: US 2020/0075722
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 30, 2025
From: HITACHI POWER SEMICONDUCTOR DEVICE LTD.
To: MINEBEA POWER SEMICONDUCTOR DEVICE INC.
Reel/Frame 071142/0232 →