Patent Assignment
Reel/Frame 049580/0711
Assignment of Assignor's Interest
Recorded: 2019-06-25
Pages: 3
Assignors
MALLIK, DEBENDRA
Executed: 2019-06-24
CHAN ARGUEDAS, SERGIO ANTONIO
Executed: 2019-06-24
YAO, JIMIN
Executed: 2019-06-24
JHA, CHANDRA MOHAN
Executed: 2019-06-24
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Package with Solder Array Thermal Interface Material (Sa-Tim)