Patent Assignment
Reel/Frame 049587/0561
Assignment of Assignor's Interest
Recorded: 2019-06-25
Pages: 3
Assignors
TSENG, TUNG-CHING
Executed: 2019-05-21
YANG, SUNG-PO
Executed: 2019-05-22
LEE, FENG-TAO
Executed: 2019-05-22
CHEN, SHIH FANG
Executed: 2019-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Apparatus for Wafer Processing