Patent Assignment
Reel/Frame 049619/0895
Assignment of Assignor's Interest
Recorded: 2019-06-28
Pages: 6
Assignors
NAKAMURA, KEISUKE
Executed: 2019-04-19
SUITA, MUNEYOSHI
Executed: 2019-04-19
IMAI, AKIFUMI
Executed: 2019-04-19
KURAHASHI, KENICHIRO
Executed: 2019-04-19
SHINAGAWA, TOMOHIRO
Executed: 2019-05-10
MATSUDA, TAKASHI
Executed: 2019-04-19
YOSHITSUGU, KOJI
Executed: 2019-04-19
YAGYU, EIJI
Executed: 2019-04-22
NISHIMURA, KUNIHIKO
Executed: 2019-04-22
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Manufacturing Method and Semiconductor Manufacturing Device