IP Library › Assignment 049642/0771
Patent Assignment
Reel/Frame 049642/0771

Assignment of Assignor's Interest

Recorded: 2019-07-01 Pages: 4
Assignors
CHENG, MING-DA
Executed: 2019-06-18
CHAO, YUNG-CHING
Executed: 2019-06-18
TZENG, CHUN KAI
Executed: 2019-06-18
JEN, LIN CHENG
Executed: 2019-06-18
WEI, KANG CHIN
Executed: 2019-06-18
CHEN, YU-FENG
Executed: 2019-06-18
LII, MIRNG-JI
Executed: 2019-06-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Metal Bumps and Method Forming Same
Application: 16/458,719 →
Publication: US 2020/0105696
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Typographical Error in the 4TH and 5TH Inventors Name Previously Recorded on Reel 049642 Frame 0771. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest. Feb 24, 2021
From: CHENG, MING-DA; CHAO, YUNG-CHING; TZENG, CHUN KAI; LIN, CHENG JEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 055403/0080 →