Patent Assignment
Reel/Frame 049644/0833
Assignment of Assignor's Interest
Recorded: 2019-07-01
Pages: 4
Assignors
YU, JEN-JUI
Executed: 2019-06-04
PEI, HAO-JAN
Executed: 2019-06-04
CHEN, WEI-YU
Executed: 2019-06-04
CHANG, CHIA-LUN
Executed: 2019-06-03
LIN, HSIU-JEN
Executed: 2019-05-27
HSIEH, CHING-HUA
Executed: 2019-06-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method