Patent Assignment
Reel/Frame 049654/0012
Assignment of Assignor's Interest
Recorded: 2019-07-02
Pages: 4
Assignors
ABE, SHINICHIRO
Executed: 2019-04-17
KURAFUCHI, KAZUHIKO
Executed: 2019-04-17
MINEGISHI, TOMONORI
Executed: 2019-04-17
MITSUKURA, KAZUYUKI
Executed: 2019-04-17
TOBA, MASAYA
Executed: 2019-04-17
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Wiring Layer Laminate for Semiconductor, and Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →