IP Library Assignment 049659/0102
Patent Assignment
Reel/Frame 049659/0102

Assignment of Assignor's Interest

Recorded: 2019-07-02 Pages: 3
Assignors
KOIKE, OSAMU
Executed: 2018-02-02
KADOGAWA, YUTAKA
Executed: 2018-02-02
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
2-4-8 SHINYOKOHAMA, KOUHOKU-KU, YOKOHAMA, 222-8575, JAPAN
Covered Property (1)
Method for Manufacturing a Semiconductor Device Having a Dummy Section
Application: 16/460,969 →
Publication: US 2019/0326173
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 11, 2022
From: LAPIS SEMICONDUCTOR CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 059559/0280 →
Assignment of Assignor's Interest Jun 19, 2022
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0398 →