IP Library › Assignment 049698/0217
Patent Assignment
Reel/Frame 049698/0217

Assignment of Assignor's Interest

Recorded: 2019-07-09 Pages: 5
Assignors
SEDDON, MICHAEL J.
Executed: 2019-01-22
NOMA, TAKASHI
Executed: 2019-01-24
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Substrate Alignment Systems and Related Methods
Application: 16/505,949 →
Publication: US 2020/0243366
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 26, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051145/0062 →
Corrective Assignment to Correct the Exclusion of Fairchild Semiconductor Corporation of Conveying Party Previously Recorded on Reel 051145 Frame 0062. Assignor(S) Hereby Confirms the Security Interest. Dec 3, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051170/0781 →
Release of Security Interest in Patents Recorded at Reel 051145, Frame 0062 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0474 →