Patent Assignment
Reel/Frame 049717/0872
Assignment of Assignor's Interest
Recorded: 2019-07-10
Pages: 5
Assignors
HSIEH, CHI-WEN
Executed: 2019-06-04
HUNG, CHIEN-PING
Executed: 2019-06-04
CHANG, CHI-KANG
Executed: 2019-06-04
FU, SHIH-CHI
Executed: 2019-06-04
CHEN, KUEI-SHUN
Executed: 2019-06-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device and Semiconductor Device