Patent Assignment
Reel/Frame 049731/0686
Assignment of Assignor's Interest
Recorded: 2019-07-11
Pages: 6
Assignors
JANG, AE-NEE
Executed: 2019-05-09
BAEK, SEUNG-DUK
Executed: 2019-05-09
KIM, TAE-HEON
Executed: 2019-05-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package