Patent Assignment
Reel/Frame 049766/0014
Assignment of Assignor's Interest
Recorded: 2019-07-16
Pages: 5
Assignors
CHUN, SHU-RONG
Executed: 2019-06-19
PAN, KUO LUNG
Executed: 2019-06-19
KUO, TIN-HAO
Executed: 2019-06-19
TSAI, HAO-YI
Executed: 2019-06-20
LEE, PEI-HSUAN
Executed: 2019-06-19
HWANG, CHIEN LING
Executed: 2019-06-19
LAI, YU-CHIA
Executed: 2019-06-19
TENG, PO-YUAN
Executed: 2019-06-19
YU, CHEN-HUA
Executed: 2019-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method