Integrated circuit package and method

1. A method comprising:

placing integrated circuit dies on a carrier substrate;

encapsulating the integrated circuit dies with an encapsulant;

forming a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure having a first diameter;

adhering a support ring to the redistribution structure, the support ring having an inner diameter and an outer diameter, the inner diameter being less than the first diameter, the outer diameter being greater than the inner diameter;

after attaching the support ring to the redistribution structure, debonding the carrier substrate from the integrated circuit dies and the encapsulant; and

attaching sockets to the redistribution structure, the sockets being surrounded by the support ring.

2. The method of claim 1 further comprising:

drilling first bolt holes through the support ring, the redistribution structure, and the encapsulant; and

bolting the support ring to the redistribution structure with first bolts extending through the first bolt holes.

3. The method of claim 2 further comprising:

drilling second bolt holes extending through the redistribution structure and the encapsulant; and

bolting a mechanical brace to the sockets with second bolts extending through the second bolt holes.

4. The method of claim 3 further comprising:

bolting a thermal module to the integrated circuit dies and the encapsulant with the second bolts.

5. The method of claim 1 , wherein the outer diameter is greater than the first diameter.

6. The method of claim 1 , wherein the outer diameter is equal to the first diameter.

7. A method comprising:

assembling a package component between a thermal module and a mechanical brace with bolts extending through the thermal module, the package component, and the mechanical brace, wherein the package component comprises:

integrated circuit dies;

an encapsulant around the integrated circuit dies;

a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies;

sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure;

external connectors over the redistribution structure, the external connectors being electrically coupled to the redistribution structure; and

a support ring over the redistribution structure and surrounding the sockets and the external connectors, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure; and

tightening fasteners on the bolts to increase force applied to the package component by the thermal module and the mechanical brace.

8. The method of claim 7 further comprising:

inserting modules in the sockets.

9. The method of claim 7 further comprising:

connecting the external connectors to an external system.

10. The method of claim 7 , wherein the support ring has a first portion laterally overlapping the redistribution structure, and a second portion extending beyond the outermost edges of the redistribution structure.

11. The method of claim 7 , wherein the support ring is laterally confined within the outermost edges of the redistribution structure.

12. The method of claim 7 , wherein the support ring has a constant width.

13. The method of claim 7 , wherein the support ring has a width decreasing linearly in a direction extending away from a major surface of the redistribution structure.

14. The method of claim 7 , wherein the support ring has a width decreasing in steps in a direction extending away from a major surface of the redistribution structure.

15. The method of claim 7 , wherein the support ring has a non-truncated circular shape.

16. The method of claim 7 , wherein the support ring has a truncated circular shape.

17. The method of claim 7 , wherein the bolts comprise:

first bolts extending through the mechanical brace, the redistribution structure, the encapsulant, and the thermal module; and

second bolts extending through the support ring, the redistribution structure, the encapsulant, and the thermal module.

18. A method comprising:

encapsulating integrated circuit dies with an encapsulant;

forming a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure comprising redistribution lines connected to the integrated circuit dies;

attaching a support ring around a periphery of the redistribution structure, the support ring having a same top-down shape as the redistribution structure, the support ring having a greater Young's modulus than the redistribution structure, the encapsulant, and the integrated circuit dies; and

attaching sockets to the redistribution structure, the sockets being surrounded by the support ring.

19. The method of claim 18 , wherein attaching the support ring around the periphery of the redistribution structure comprises:

drilling bolt holes through the support ring, the redistribution structure, and the encapsulant; and

bolting the support ring to the redistribution structure with bolts extending through the bolt holes.

20. The method of claim 18 , wherein the redistribution structure has a first diameter, and the support ring has an inner diameter and an outer diameter, the inner diameter being less than the first diameter, the outer diameter being greater than the first diameter.