Patent Assignment
Reel/Frame 049823/0664
Assignment of Assignor's Interest
Recorded: 2019-07-22
Pages: 4
Assignors
YOKOYAMA, YOSHINORI
Executed: 2019-05-27
FUJITA, JUN
Executed: 2019-05-28
SHINOHARA, TOSHIAKI
Executed: 2019-06-02
KOBAYASHI, HIROSHI
Executed: 2019-05-27
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device, Method for Manufacturing the Same, and Semiconductor Module