Patent Assignment
Reel/Frame 049875/0247
Assignment of Assignor's Interest
Recorded: 2019-07-26
Pages: 6
Assignors
LEWANDOWSKI, ERIC PETER
Executed: 2019-07-26
NAH, JAE-WOONG
Executed: 2019-07-26
YAU, JENG-BANG
Executed: 2019-07-26
SORCE, PETER JEROME
Executed: 2019-07-26
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
System and Method for Forming Solder Bumps
Patent:
10,879,202 →
Application:
16/523,620 →