Patent Assignment
Reel/Frame 049889/0231
Assignment of Assignor's Interest
Recorded: 2019-07-29
Pages: 3
Assignors
MENG, FAN-SHUEN
Executed: 2018-06-12
CHEN, HUANG-KUI
Executed: 2018-06-12
HSIEH, MIN-YANN
Executed: 2018-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure with Embedded Memory Device and Contact Isolation Scheme