Patent Assignment
Reel/Frame 049931/0789
Assignment of Assignor's Interest
Recorded: 2019-08-01
Pages: 4
Assignors
CHUN, SHU-RONG
Executed: 2019-06-13
PAN, KUO LUNG
Executed: 2019-06-13
LEE, PEI-HSUAN
Executed: 2019-06-13
HWANG, CHIEN LING
Executed: 2019-06-12
LAI, YU-CHIA
Executed: 2019-06-14
KUO, TIN-HAO
Executed: 2019-06-17
TSAI, HAO-YI
Executed: 2019-06-13
YU, CHEN-HUA
Executed: 2019-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Integrated Circuit Packages with Mechanical Braces