Method of forming integrated circuit packages with mechanical braces
In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.
1. A method comprising:
forming a package component comprising integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure;
assembling the package component between a thermal module and a mechanical brace with bolts extending through the thermal module, the package component, and the mechanical brace, wherein the mechanical brace has openings, wherein after the assembling, each one of the openings exposes a respective one of the sockets; and
tightening fasteners on the bolts to increase force applied to the package component by the thermal module and the mechanical brace.
2. The method of claim 1 , wherein the mechanical brace comprises:
a rigid layer having a first stiffness; and
a soft layer disposed between the rigid layer and the sockets, the soft layer having a second stiffness, the second stiffness being less than the first stiffness.
3. The method of claim 1 , wherein the openings and the bolts have a layout with a regular pattern.
4. The method of claim 1 , wherein the openings and the bolts have a layout with a symmetrical irregular pattern.
5. The method of claim 1 , wherein the openings and the bolts have a layout with an asymmetrical irregular pattern.
6. A method comprising:
forming a package component comprising an integrated circuit die, a redistribution structure over the integrated circuit die, and a socket over the redistribution structure;
attaching a mechanical brace to a first side of the package component so that the mechanical brace is physically coupled to edge regions of the socket, the mechanical brace comprising a rigid layer and a soft layer disposed between the rigid layer and the socket, the rigid layer having a first stiffness, the soft layer having a second stiffness, the second stiffness being less than the first stiffness; and
attaching a thermal module to a second side of the package component so that the thermal module is thermally coupled to the integrated circuit die.
7. The method of claim 6 , wherein the socket has a third stiffness, the second stiffness being less than the third stiffness.
8. The method of claim 6 , wherein the rigid layer comprises a metal.
9. The method of claim 6 , wherein the soft layer comprises a metal foil.
10. The method of claim 6 , wherein the soft layer comprises an elastomer.
11. The method of claim 6 , wherein the rigid layer has a first thickness, the soft layer has a second thickness, and the first thickness is greater than the second thickness.
12. The method of claim 6 , wherein the rigid layer has an inner frame portion and an outer frame portion surrounding the inner frame portion, the soft layer has an inner frame portion and an outer frame portion surrounding the inner frame portion, and the outer frame portion of the rigid layer and the outer frame portion of the soft layer have the same width.
13. The method of claim 6 , wherein the rigid layer has an inner frame portion and an outer frame portion surrounding the inner frame portion, the soft layer has an inner frame portion and an outer frame portion surrounding the inner frame portion, the outer frame portion of the rigid layer has a first width, the outer frame portion of the soft layer has a second width, and the first width is greater than the second width.
14. The method of claim 6 , wherein the rigid layer has an inner frame portion and an outer frame portion surrounding the inner frame portion, and the outer frame portion of the rigid layer has a square shape.
15. The method of claim 6 , wherein the rigid layer has an inner frame portion and an outer frame portion surrounding the inner frame portion, and the outer frame portion of the rigid layer has a non-truncated circular shape.
16. The method of claim 6 , wherein the rigid layer has an inner frame portion and an outer frame portion surrounding the inner frame portion, and the outer frame portion of the rigid layer has a truncated circular shape.
17. A method comprising:
forming a package component comprising integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure;
assembling the package component between a thermal module and a mechanical brace with bolts extending through the thermal module, the package component, and the mechanical brace, wherein the mechanical brace comprises a rigid layer and a soft layer disposed between the rigid layer and the sockets; and
tightening fasteners on the bolts to increase force applied to the package component by the thermal module and the mechanical brace, the soft layer conforming to a shape of the sockets.
18. The method of claim 17 , wherein a Young's modulus of the soft layer is less than a Young's modulus of the rigid layer, and the Young's modulus of the soft layer is less than a Young's modulus of the sockets.
19. The method of claim 17 , wherein the soft layer comprises an elastomer, and the rigid layer comprises a metal.
20. The method of claim 17 , wherein the soft layer comprises a metal foil, and the rigid layer comprises a metal.