Patent Assignment
Reel/Frame 049941/0812
Assignment of Assignor's Interest
Recorded: 2019-08-02
Pages: 10
Assignors
KIM, YUNG BAE
Executed: 2019-08-01
SIMKA, HARSONO
Executed: 2019-08-01
LEE, JONG HYUN
Executed: 2019-08-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including a via and Methods of Forming the Same