Integrated circuit devices including a via and methods of forming the same
View Patent ↗Integrated circuit devices and methods of forming the same are provided. The methods of forming an integrated circuit device may include forming a first insulating layer and a first conductive layer on a substrate and selectively forming a second insulating layer on the first insulating layer. The first insulating layer may include a recess, and the first conductive layer may be in the recess of the first insulating layer. The second insulating layer may include a first opening exposing a surface of the first conductive layer. The methods may also include forming a third insulating layer on the second insulating layer and the first conductive layer, forming a second opening extending through the third insulating layer and exposing the first conductive layer, and forming a second conductive layer in the second opening.
1. A method of forming an integrated circuit device, the method comprising:
forming a first insulating layer and a first conductive layer on a substrate, the first insulating layer comprising a recess, and the first conductive layer being in the recess of the first insulating layer;
selectively forming a second insulating layer on the first insulating layer, the second insulating layer comprising a first opening exposing a surface of the first conductive layer;
forming a third insulating layer on the second insulating layer and the first conductive layer;
forming a second opening extending through the third insulating layer and exposing the first conductive layer; and
forming a second conductive layer in the second opening,
wherein forming the first conductive layer comprises forming a diffusion barrier layer and a first core conductive layer, and
wherein the method further comprises removing an upper portion of the diffusion barrier layer before forming the third insulating layer.
2. The method of claim 1 , further comprising removing an upper portion of the first conductive layer before forming the third insulating layer.
3. The method of claim 2 , wherein removing the upper portion of the first conductive layer is performed before selectively forming the second insulating layer.
4. The method of claim 1 , wherein removing the upper portion of the diffusion barrier layer is performed before selectively forming the second insulating layer, and
wherein selectively forming the second insulating layer comprises forming a portion of the second insulating layer in a space from which the upper portion of the diffusion barrier layer is removed.
5. The method of claim 1 , further comprising forming an etch stop layer on the second insulating layer before forming the third insulating layer.
6. The method of claim 1 , wherein the second conductive layer contacts the first conductive layer.
7. The method of claim 6 , wherein an upper surface of the substrate is closer to a lowermost end of the second conductive layer than a lowermost end of the second insulating layer.
8. A method of forming an integrated circuit device, the method comprising:
forming a first insulating layer and a first conductive layer on a substrate, the first insulating layer comprising a recess, and the first conductive layer being in the recess of the first insulating layer;
forming a blocking layer on the first conductive layer, the blocking layer exposing a surface of the first insulating layer;
forming a second insulating layer on the first insulating layer, the second insulating layer exposing a surface of the blocking layer;
removing the blocking layer to form an opening in the second insulating layer;
forming a third insulating layer on the second insulating layer and the first conductive layer after removing the blocking layer; and
forming a second conductive layer extending through the third insulating layer, the second conductive layer contacting the first conductive layer.
9. The method of claim 8 , wherein the blocking layer contacts an entirety of an upper surface of the first conductive layer.
10. The method of claim 8 , wherein the first insulating layer comprises a material that the second insulating layer comprises.
11. The method of claim 8 , further comprising removing an upper portion of the first conductive layer before forming the third insulating layer.
12. The method of claim 11 , wherein removing the upper portion of the first conductive layer is performed before forming the blocking layer.
13. The method of claim 8 , wherein forming the first conductive layer comprises forming a diffusion barrier layer and a first core conductive layer; and
wherein the method further comprises removing an upper portion of the diffusion barrier layer before forming the third insulating layer.
14. The method of claim 13 , wherein removing the upper portion of the diffusion barrier layer is performed before forming the blocking layer, and
wherein forming the second insulating layer comprises forming a portion of the second insulating layer in a space from which the upper portion of the diffusion barrier layer is removed.
15. The method of claim 8 , wherein the first conductive layer comprises Cu, Co, Ru, Mo, Mn, and/or Nb.
16. A method of forming an integrated circuit device, the method comprising:
forming a first insulating layer and a first conductive layer on a substrate, the first insulating layer comprising a recess, the first conductive layer being in the recess of the first insulating layer, and the first insulating layer exposing an upper surface of the first conductive layer;
removing an upper portion of the first conductive layer;
selectively forming a second insulating layer on the first insulating layer, wherein the first insulating layer and the second insulating layer comprise an opening exposing a surface of the first conductive layer that remains after removing the upper portion of the first conductive layer, and the opening exposes a sidewall of the first insulating layer and a sidewall of the second insulating layer;
forming a third insulating layer on the second insulating layer and the first conductive layer; and
forming a second conductive layer extending through the third insulating layer to contact the first conductive layer.
17. The method of claim 16 , wherein selectively forming the second insulating layer comprises:
forming a blocking layer on the first conductive layer, the blocking layer exposing a surface of the first insulating layer;
forming the second insulating layer on the first insulating layer, the second insulating layer exposing a surface of the blocking layer; and
removing the blocking layer.
18. The method of claim 17 , wherein the blocking layer contacts the first conductive layer, and
wherein the second insulating layer contacts the first insulating layer.
19. The method of claim 16 , wherein removing the upper portion of the first conductive layer is performed before selectively forming the second insulating layer.
20. The method of claim 1 , wherein the first opening comprises an upper portion, and the first opening further comprises a lower portion that exposes a sidewall of the first insulating layer.