Self-aligned scheme for semiconductor device and method of forming the same
In an embodiment, a method includes forming a first conductive feature in a first inter-metal dielectric (IMD) layer; depositing a blocking film over and physically contacting the first conductive feature; depositing a first dielectric layer over and physically contacting the first IMD layer; depositing a second dielectric layer over and physically contacting the first dielectric layer; removing the blocking film; depositing an etch stop layer over any physically contacting the first conductive feature and the second dielectric layer; forming a second IMD layer over the etch stop layer; etching an opening in the second IMD layer and the etch stop layer to expose the first conductive feature; and forming a second conductive feature in the opening.
1 . A device comprising:
a first conductive feature and a second conductive feature embedded in a first insulating layer, the first conductive feature being a first distance from the second conductive feature;
a low-k dielectric layer disposed over the first insulating layer;
a high-k dielectric layer disposed over the low-k dielectric layer;
a second insulating layer disposed over the high-k dielectric layer; and
a third conductive feature embedded in the second insulating layer and physically contacting the first conductive feature, the high-k dielectric layer being directly interposed between a first portion and a second portion of the third conductive feature, the first portion of the third conductive feature being a second distance from the second conductive feature, the second distance being less than the first distance.
2 . The device of claim 1 , wherein the second portion of the third conductive feature is a third distance from the second conductive feature, the third distance being less than the first distance.
3 . The device of claim 2 , wherein the second portion is interposed between the first insulating layer and the high-k dielectric layer.
4 . The device of claim 1 , wherein the third conductive feature further physically contacts sidewalls of the low-k dielectric layer, the high-k dielectric layer, and the second insulating layer.
5 . The device of claim 4 , wherein the third conductive feature further physically contacts a top surface of the high-k dielectric layer.
6 . The device of claim 1 , wherein the high-k dielectric layer being directly interposed between the first portion and the second portion of the third conductive feature comprises:
the first portion being in physical contact with an upper surface of the high-k dielectric layer; and
the second portion being in physical contact with a lower surface of the high-k dielectric layer, the lower surface being opposite to the upper surface.
7 . The device of claim 1 , wherein the first conductive feature comprises a cobalt capping layer, and wherein a sidewall of the cobalt capping layer is in physical contact with a sidewall of the low-k dielectric layer.
8 . The device of claim 1 , wherein the low-k dielectric layer comprises a first segment extending between the third conductive feature and the second conductive feature, wherein the high-k dielectric layer comprises a second segment extending between the third conductive feature and the second conductive feature, and wherein the first segment is shorter than the second segment.
9 . A device comprising:
a first conductive feature embedded in a first inter-metal dielectric (IMD) layer;
a low-k dielectric layer disposed over the first IMD layer;
a high-k dielectric layer disposed over the low-k dielectric layer;
an etch stop layer disposed over and physically contacting the first conductive feature and the high-k dielectric layer;
a second IMD layer disposed over the etch stop layer; and
a second conductive feature embedded in the second IMD layer and physically contacting the first conductive feature, the high-k dielectric layer, the etch stop layer, and the second IMD layer, the second conductive feature comprising an underbite portion interposed between the high-k dielectric layer and the first IMD layer.
10 . The device of claim 9 , wherein the second conductive feature further physically contacts the low-k dielectric layer.
11 . The device of claim 9 , wherein the second conductive feature comprises an overbite portion directly above the high-k dielectric layer and the first IMD layer.
12 . The device of claim 9 further comprising a third conductive feature embedded in the first IMD layer and laterally displaced from the first conductive feature.
13 . The device of claim 12 , wherein the third conductive feature is closer to the second conductive feature than to the first conductive feature.
14 . The device of claim 9 , wherein the first conductive feature comprises a cobalt capping layer, and wherein a sidewall of the cobalt capping layer physically contacts a sidewall of the low-k dielectric layer.
15 . A device comprising:
a first extra-low-k dielectric layer over a substrate;
a first conductive feature and a second conductive feature embedded in the first extra-low-k dielectric layer, the first extra-low-k dielectric layer comprising a first segment extending from the first conductive feature to the second conductive feature;
a low-k dielectric layer over the first extra-low-k dielectric layer, the low-k dielectric layer comprising a second segment extending along a top surface of the first segment and between the first conductive feature and the second conductive feature;
a high-k dielectric layer over the low-k dielectric layer, the high-k dielectric layer comprising a third segment extending along a top surface of the second segment and between the first conductive feature and the second conductive feature;
an etch stop layer over the high-k dielectric layer, the etch stop layer comprising a fourth segment extending along a top surface of the third segment, a sidewall of the third segment, and a sidewall of the second segment;
a second extra-low-k dielectric layer over the high-k dielectric layer; and
a third conductive feature embedded in the second extra-low-k dielectric layer and in physical contact with the first conductive feature.
16 . The device of claim 15 , wherein the fourth segment of the etch stop layer is in physical contact with the third conductive feature and the second conductive feature.
17 . The device of claim 15 , wherein the third segment is longer than the second segment.
18 . The device of claim 15 , wherein the third conductive feature comprises a first portion in physical contact with the second segment and the third segment, and wherein the first portion is directly interposed between the second segment and the third segment.
19 . The device of claim 18 , wherein the first portion of the third conductive feature is closer to the second conductive feature than the first conductive feature is to the second conductive feature.
20 . The device of claim 9 , wherein in a cross-section a first segment of the low-k dielectric layer extends along the first IMD layer between the first conductive feature and the second conductive feature, wherein in the cross-section a second segment of the high-k dielectric layer extends along the first segment, wherein an upper surface of the first segment is in contact with a lower surface of the second segment, and wherein the lower surface of the second segment is longer than the upper surface of the first segment.