Patent Assignment
Reel/Frame 049980/0886
Assignment of Assignor's Interest
Recorded: 2019-08-06
Pages: 4
Assignors
SHIBATA, TOMOAKI
Executed: 2017-05-23
YORI, HANAKO
Executed: 2017-05-23
MINEGISHI, TOMONORI
Executed: 2017-05-23
ABE, HIDENORI
Executed: 2017-06-01
MASUKO, TAKASHI
Executed: 2017-05-29
OTAKE, SHUNSUKE
Executed: 2017-06-19
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Therefor, and Resin Composition for Forming Flexible Resin Layer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →