Patent Assignment
Reel/Frame 049986/0869
Assignment of Assignor's Interest
Recorded: 2019-08-07
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Flip-Chip Light Emitting Diode, Manufacturing Method of Flip-Chip Light Emitting Diode and Display Device Including Flip-Chip Light Emitting Diode