Patent Assignment
Reel/Frame 050005/0718
Assignment of Assignor's Interest
Recorded: 2019-08-08
Pages: 5
Assignors
SANKMAN, ROBERT
Executed: 2019-07-29
SUBBAREDDY, DHEERAJ
Executed: 2019-07-29
HOSSAIN, MD ALTAF
Executed: 2019-07-29
NALAMALPU, ANKIREDDY
Executed: 2019-07-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Connectivity Between Integrated Circuit Dice in a Multi-Chip Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.