Patent Assignment
Reel/Frame 050012/0707
Release of Security Interest
Recorded: 2019-08-09
Pages: 14
Assignor
BDC CAPITAL INC.
Executed: 2018-11-06
Assignee
REFLEX PHOTONICS INC.
16771 CHEMIN SAINTE-MARIE, KIRKLAND, H9H 5H3, CANADA
Covered Properties
(5)
Optical Ferrule
Encapsulated Optical Package
Optically-Enabled Integrated Circuit Package
Two Substrate Parallel Optical Sub-Assembly
Method for Assembling a Two Substrate Parallel Optical Sub-Assembly
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 4, 2004
From: MAJ, TOMASZ
To: REFLEX PHOTONIQUE INC./REFLEX PHOTONICS INC.
Reel/Frame 014950/0132 →
Assignment of Assignor's Interest
Feb 4, 2004
From: ROLSTON, DAVID R.
To: REFLEX PHOTONIQUE INC./REFLEX PHOTONICS INC.
Reel/Frame 014950/0122 →
Assignment of Assignor's Interest
Sep 28, 2007
From: ROLSTON, DAVID R.; MAINARDI, RICHARD; FU, SHAO-WEI; VARANO, ROBERT
To: REFLEX PHOTONICS
Reel/Frame 019893/0953 →
Assignment of Assignor's Interest
Mar 3, 2009
From: ROLSTON, DAVID R.; MAINARDI, RICHARD; FU, SHAO-WEI; VARANO, ROBERT
To: REFLEX PHOTONICS
Reel/Frame 022335/0238 →
Assignment of Assignor's Interest
Feb 17, 2010
From: ROLSTON, DAVID ROBERT CAMERON; MAINARDI, RICHARD; FU, SHAO-WEI
To: REFLEX PHOTONIQUE INC. / REFLEX PHOTONICS INC.
Reel/Frame 023951/0225 →
Assignment of Assignor's Interest
Aug 25, 2010
From: ROLSTON, DAVID ROBERT CAMERON; MAJ, TOMASZ; FU, SHAO-WEI
To: REFLEX PHOTONICS INC.
Reel/Frame 024882/0808 →
Security Interest
Feb 2, 2012
From: REFLEX PHOTONIQUE INC./REFLEX PHOTONICS INC.
To: BDC CAPITAL INC.
Reel/Frame 027817/0689 →