Encapsulated optical package
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.
1. A screen-printing method of encapsulating an optoelectronic chip on a substrate, the method comprising:
providing a substrate having an upper surface;
securing an optoelectronic chip on said upper surface;
on said upper surface, providing borders with a height that surround at least a portion of said optoelectronic chip, said height being determined in accordance with a desired thickness for an optical window;
applying a light transmissible coating over at least a portion of the optoelectronic chip;
squeegeing said coating to create said optical window having said desired thickness, said squeegeing comprising abutting a flat edge tool against top ends of the borders and dragging the flat edge tool on top of the light transmissible coating while maintaining contact with the borders; and
allowing said coating to harden, to thereby provide an encapsulated optoelectronic chip on said substrate.
2. The method as in claim 1 , further comprising providing more than one of said optoelectronic chip, said optoelectronic chips assembled in an array.
3. The method as in claim 2 , further comprising separating said substrate into parts, said parts each having one of said optoelectronic chips.
4. The method as in claim 3 , comprising breaking said substrate into said parts.
5. The method as in claim 4 , wherein said providing a substrate further comprises providing a substrate having pre-cuts or scoring trenches which are used for said breaking.
6. The method as claimed in claim 1 , wherein allowing said coating substance to harden comprises curing said coating substance using ultraviolet illumination.
7. The method as in claim 6 , further comprising masking regions of said coating substance prior to said curing.
8. The method as claimed in claim 1 , further comprising the step of electrically connecting at least one of a plurality of pins of the optoelectronic chip to a corresponding trace line on said substrate.
9. The method as claimed in claim 1 , further comprising choosing a value for said desired thickness that is required for coupling light from the optoelectronic chip to an optical element adjacent to said upper surface.
10. The method as claimed in claim 1 , further comprising choosing a value for said determined height that is required for coupling light from the chip to an optical fiber adjacent to said upper surface.
11. The method as in claim 1 , wherein said borders comprise removable borders.
12. The method as in claim 1 , further comprising polishing said coating to create said optical window.