IP Library › Assignment 050013/0422
Patent Assignment
Reel/Frame 050013/0422

Assignment of Assignor's Interest

Recorded: 2019-08-09 Pages: 5
Assignors
LIANTO, PRAYUDI
Executed: 2019-07-25
SEE, GUAN HUEI
Executed: 2019-07-25
THIRUNAVUKARASU, SRISKANTHARAJAH
Executed: 2019-07-25
SUNDARRAJAN, ARVIND
Executed: 2019-07-26
DAI, XUNDONG
Executed: 2019-07-29
FUNG, PETER KHAI MUM
Executed: 2019-07-26
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Methods for Bonding Substrates
Application: 16/520,680 →
Publication: US 2020/0135690
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 5, 2019
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 050917/0604 →