IP Library › Assignment 050019/0031
Patent Assignment
Reel/Frame 050019/0031

Assignment of Assignor's Interest

Recorded: 2019-08-09 Pages: 3
Assignors
YEONG, SAI-HOOI
Executed: 2019-07-26
YU, CHIA-TA
Executed: 2019-07-26
HUANG, YEN-CHIEH
Executed: 2019-07-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Three Dimensional Metal Insulator Metal Capacitor Structure
Application: 16/515,915 →
Publication: US 2021/0020739