Patent Assignment
Reel/Frame 050019/0056
Assignment of Assignor's Interest
Recorded: 2019-08-09
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
High Breakdown Voltage Inter-Metal Dielectric Layer