High breakdown voltage inter-metal dielectric layer

1. A method of forming a semiconductor structure, comprising:

depositing an etch stop layer (ESL) over a first dielectric layer, wherein the depositing comprises:

performing, on the first dielectric layer, a first plasma treatment process comprising an ammonia-based plasma process;

performing a deposition cycle to form a first sublayer of the ESL, comprising:

flowing a first precursor over the plasma-treated first dielectric layer, wherein the first precursor comprises aluminum;

purging at least a portion of the first precursor;

flowing a second precursor over the plasma-treated first dielectric layer to form the first sublayer of the ESL; and

purging at least a portion of the second precursor;

performing a second deposition cycle to form a second sublayer of the ESL on the first sublayer of the ESL; and

performing a second plasma treatment process on the first sublayer of the ESL prior to performing the second deposition cycle, wherein the second plasma treatment process comprises an oxygen-based plasma process;

depositing a second dielectric layer on the ESL; and

forming a via in the second dielectric layer and through the ESL.

2. The method of claim 1 , wherein depositing the ESL comprises depositing aluminum oxide.

3. The method of claim 1 , wherein the first precursor comprises trimethylaluminum (TMA).

4. The method of claim 1 , wherein the second precursor comprises one of tert-butanol ((CH 3 ) 3 COH), H 2 O, ethylene glycol, or tert-amyl alcohol (TAA).

5. The method of claim 1 , wherein performing the first plasma treatment process comprises flowing ammonia (NH 3 ) over the first dielectric layer at a temperature between about 150 degrees Celsius and about 400 degrees Celsius and at a chamber pressure between about 0.5 Torr and about 10 Torr.

6. The method of claim 1 , wherein a temperature of the second plasma treatment process is between about 150 degrees Celsius and about 400 degrees Celsius.

7. The method of claim 1 , further comprising depositing copper in the via.

8. The method of claim 1 , further comprising repeating the deposition cycle.

9. A method of forming a semiconductor structure, comprising:

forming a conductive structure in a first dielectric layer;

performing, on the first dielectric layer, a first plasma treatment process comprising an ammonia-based plasma process;

depositing a second dielectric layer over the first dielectric layer, wherein the depositing comprises depositing an aluminum oxide layer with an oxygen to aluminum atomic ratio of about 1.2 to about 2.3 by:

flowing a first precursor over the first dielectric layer;

removing at least a portion of the first precursor;

flowing a second precursor over the first dielectric layer;

removing at least a portion of the second precursor; and

performing a second plasma treatment process on the second dielectric layer;

depositing a third dielectric layer on the second dielectric layer; and

forming a via in the third dielectric layer and through the second dielectric layer.

10. The method of claim 9 , wherein the first precursor comprises trimethylaluminum (TMA).

11. The method of claim 9 , wherein the second precursor comprises one of tert-butanol ((CH 3 ) 3 COH), H 2 O, ethylene glycol, or tert-amyl alcohol (TAA).

12. The method of claim 9 , wherein:

performing the second plasma treatment process on the second dielectric layer comprises performing an oxygen-based plasma process.

13. The method of claim 9 , wherein forming the conductive structure comprises depositing cobalt.

14. The method of claim 13 , further comprising depositing copper in the via.

15. The method of claim 9 , further comprising:

forming a plurality of metal structures in the first dielectric layer; and

performing a third plasma treatment on the plurality of metal structures.

16. A method of forming a semiconductor interconnect structure, comprising:

depositing a first dielectric layer in a deposition chamber;

forming a plurality of metal structures in the first dielectric layer;

performing a first plasma treatment on the first dielectric layer and the plurality of metal structures in the deposition chamber;

forming an etch stop layer with an aluminum content of about 30% to about 45%, an oxygen content of about 55% to about 70%, and a hydrogen content of about 0.5% to about 3% on the first dielectric layer, comprising:

flowing a trimethylaluminum (TMA) precursor over the first dielectric layer;

purging at least a portion of the TMA precursor, wherein the purging comprises flowing a first inert gas into the deposition chamber;

flowing a second precursor into the deposition chamber, wherein the second precursor is configured to react with dangling bonds of the TMA precursor; and

purging at least a portion of the second precursor, wherein the purging comprises flowing a second inert gas into the deposition chamber;

performing a second plasma treatment on the etch stop layer; and

depositing a second dielectric layer on the etch stop layer.

17. The method of claim 16 , wherein flowing the second precursor comprises flowing tert-butanol ((CH 3 ) 3 COH), H 2 O, ethylene glycol, and tert-amyl alcohol (TAA) into the deposition chamber.

18. The method of claim 16 , wherein performing the first plasma treatment comprises performing the first plasma treatment at a temperature between about 150° C. and about 400° C.

19. The method of claim 16 , wherein forming the etch stop layer further comprises flowing ammonia (NH 3 ) into the deposition chamber prior to flowing the TMA precursor.

20. The method of claim 16 , wherein performing the second plasma treatment comprises performing an oxygen-based plasma process.