Patent Assignment
Reel/Frame 050019/0066
Assignment of Assignor's Interest
Recorded: 2019-08-09
Pages: 4
Assignors
CHANG, FONG-YUAN
Executed: 2019-07-17
LIU, CHIN-CHOU
Executed: 2019-07-17
CHIEN, CHIN-HER
Executed: 2019-07-17
HUANG, PO-HSIANG
Executed: 2019-07-17
ETTUVEETTIL, NOOR MOHAMED
Executed: 2019-07-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Through Silicon via Optimization for Three-Dimensional Integrated Circuits