Patent Assignment
Reel/Frame 050037/0060
Assignment of Assignor's Interest
Recorded: 2019-08-13
Pages: 3
Assignor
TANIGAKI, TSUYOSHI
Executed: 2019-07-08
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device Comprising Electronic Components Electrically Joined to Each Other via Metal Nanoparticle Sintered Layer and Method of Manufacturing the Same